Products
Sample Availability & Requests
We offer three sample configurations—one single-sided and two double-sided types—to meet diverse application requirements.
Thermal Release Tape
Thermal Release Tape (200°C Thermal Release Type)
*The reverse side of the measurement surface was fixed to an aluminum (Al) plate.The foaming side was laminated with PET#25 film and pressed using a 2kg roller for one back-and-forth cycle at a speed of 5mm/s.After 20 minutes of curing, the PET film was peeled off.Peel Angle: 180° Peel Speed: 300 mm / 8 min
Thermal Release Tape(TEX220-T37: 220°C Thermal Release Type)
*The reverse side of the measurement surface was fixed to an aluminum (Al) plate.The foaming surface was laminated with PET#25 film and pressed using a 2kg roller for one back-and-forth cycle at a speed of 5mm/s.After curing for 20 minutes, the PET film was peeled off.Peel Angle: 180°Peel Speed: 300 mm/min
Thermal Release Tape(TEX280-T17: 280°C Thermal Release Type)
*The adhesive side was laminated onto a silicone dummy wafer and pressed using a 2kg roller for one back-and-forth cycle at a speed of 5mm/s.After curing for 20 minutes, the tape was peeled off.Peel Angle: 90°Peel Speed: 300 mm/min
Low-Contamination, High-Heat-Resistant Adhesive Film
・Minimal volatile components even at high temperatures, preventing degradation of both the environment and the product.
・Our rigorous quality control (thickness uniformity and contamination/foreign matter detection) contributes to significantly reducing defect rates.
SiC Polishing Slurry (SiC-70S by BAIKOWSKI)
SiC研磨用スラリー(BAIKOWSKI社製 SiC-70S)
While SiC is a vital material for power device substrates, its extreme hardness and chemical stability make it one of the most challenging materials to polish.To achieve superior polishing rates, SiC slurries often contain hazardous chemicals, which complicates both product handling and waste disposal.
BAIKOWSKI has developed a new slurry that contains no hazardous chemicals. SiC-70S is an eco-friendly slurry that is easy to handle and dispose of.
