Tech Extension Co., Ltd.

Technology introduction

TECH EXTENSION Utilize the results of the Ohba Laboratory, Laboratory for Future Interdisciplinary Research of Science and Technology (FIRST), Tokyo Institute of Technology.

Learn more about the technology. Website of Ohba Lab. [Crick here]

Thinning Module for Si, SiC, GaN,…Glass Substrates

Impacts of Thinning Damage on Device Characteristics

Bonding Module for Wafer/Chip on Wafer Stacking

Advantages of Bonding with an adhesive layer

Connecting Module by Via-last after Bonding Process

Multilayer Wiring by Bump-less Cu TSV

Global 3D Process Platform for BBCube

Comparison of Structure and Footprint