TEX contributes  to science and
technology that is enriching the world.

1. We provide development support for LSI 3D integrated technologies,
including WOW (Wafer on Wafer) and COW (Chip on Wafer).

Until now, semiconductors have benefited from miniaturization, to increase the speed and reduce the voltage, and the increasing diameter of silicon wafers has improved mass production efficiency and realized cost reductions. On the other hand, however, there are limits to the degree of integration that can be achieved by miniaturization, such as increased manufacturing costs due to the difficulty of miniaturization and increased current densities. Therefore, semiconductor companies around the world are shifting their research so that the high levels of integration that have been achieved in two dimensions can also be reached in three-dimensional structures. Although various three-dimensional LSI methods are being studied, the WOW process that we use shows great promise in terms of mass production efficiency and cost. In collaboration with the Ohba Laboratory, Heterogeneous and Functional Integration Research Unit, Science Tokyo, we are continuing to study the possibilities of WOW and COW technologies.

2. We undertake the trial production of 3D laminated chips.

In order to employ WOW and COW processes, we fabricate thin stacks of silicon wafers. Therefore, we can meet various needs, such as making three-dimensional structures from silicon wafers that are currently being manufactured.

3. We support the development of various devices.

WOW and COW processes require a great deal of technical know-how. We will support the development of equipment based on the experience we have cultivated so far.