TEX contributes to science and
technology that is enriching the world.
Tech Extension Co., Ltd., is a startup company initiated by Tokyo Tech with the aim of implementing the research accomplishments of the Tokyo Tech WOW Alliance into society (practical application) . In collaboration with the Heterogeneous and Functional Integration Unit WOW Alliance of the Institute of Innovative Research, Tokyo Tech, TEX are working on the social implement of next-generation 3D integrated technology based on BBCube, which was developed by the same organization. TEX will contribute to the development of society by setting this activity as a Sustainable Development Goal.
Right now, high-performance, low-cost semiconductors are needed in society where IoT and 5G communication have become a part of people’s lives. Next-generation 3D integrated technology based on BBCube makes it possible to minimize wiring for all devices that comprise semiconductor products (including memory, CPUs, and capacitors). For example, it is possible to reduce the distance between capacitors and devices from the millimeter to micron level. TEX promotes collaborative development on the design, process, equipment, and materials including thermal design with the aim of achieving thumb-size semiconductor component products. In this way, the desire is to achieve ultra-high-speed systems that are compact and have low power consumption.
In collaboration with the Heterogeneous and Functional Integration Unit WOW Alliance, TEX is working to promote the establishment and operation of trial manufacturing lines and the development of human resources for social implementation. TEX will introduce consultation for BBCube related technologies, related equipment, and components. Implementation into society will be accelerated in Taiwan through the affiliated company, TEX Taiwan.
- We support the introduction of 3D integrated technology for LSI (WOW, COW).
- We fabricate prototypes of 3D stacked structures.
- We support the development of various devices.
- We provide procurement support related to research and development.
- We support the application of individual related technologies in other fields, such as precision lamination technology and thinning technology.
What Tech Extension can offer
1. We provide development support for LSI 3D integrated technologies,
including WOW (Wafer on Wafer) and COW (Chip on Wafer).
Until now, semiconductors have benefited from miniaturization, to increase the speed and reduce the voltage, and the increasing diameter of silicon wafers has improved mass production efficiency and realized cost reductions. On the other hand, however, there are limits to the degree of integration that can be achieved by miniaturization, such as increased manufacturing costs due to the difficulty of miniaturization and increased current densities. Therefore, semiconductor companies around the world are shifting their research so that the high levels of integration that have been achieved in two dimensions can also be reached in three-dimensional structures. Although various three-dimensional LSI methods are being studied, the WOW process that we use shows great promise in terms of mass production efficiency and cost. In collaboration with the Ohba Laboratory, Heterogeneous and Functional Integration Research Unit, Tokyo Institute of Technology, we are continuing to study the possibilities of WOW and COW technologies.
2. We undertake the trial production of 3D laminated chips.
In order to employ WOW and COW processes, we fabricate thin stacks of silicon wafers. Therefore, we can meet various needs, such as making three-dimensional structures from silicon wafers that are currently being manufactured.
3. We support the development of various devices.
WOW and COW processes require a great deal of technical know-how. We will support the development of equipment based on the experience we have cultivated so far.
4. We provide procurement support related to research and development.
Research and development requires many devices, equipment, and materials. Our wide network can meet various customer needs, regardless of the types of semiconductors used.
A press release titled "Tokyo Tech WOW Alliance and Cheng Kung Univ. Agree on Technical Cooperation for 3D Integration Technology Based on BBCube - Accelerating Social Implementation of Next-Generation 3D Stacked Semiconductor Technology -" was issued.
Tokyo Tech News / NCKU News
The technology page has been updated.
The location of the head office has changed. Outline
English Website opened.
Change of President
President Tadashi Fukuda
Website has been updated.
TEX subsidiary company (台灣梯意愛克思股份有限公司) established in Taiwan.
Tech Extension Co., Ltd. certified as a venture from Tokyo Institute of Technology (award number: 83)
Tech Extension Co., Ltd. established.